JPH0614480Y2 - 半導体熱処理装置 - Google Patents
半導体熱処理装置Info
- Publication number
- JPH0614480Y2 JPH0614480Y2 JP1988055211U JP5521188U JPH0614480Y2 JP H0614480 Y2 JPH0614480 Y2 JP H0614480Y2 JP 1988055211 U JP1988055211 U JP 1988055211U JP 5521188 U JP5521188 U JP 5521188U JP H0614480 Y2 JPH0614480 Y2 JP H0614480Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- heat
- semiconductor
- treatment area
- core tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 title claims description 82
- 239000004065 semiconductor Substances 0.000 title claims description 41
- 235000012431 wafers Nutrition 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 230000035939 shock Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 45
- 238000012545 processing Methods 0.000 description 15
- 238000007789 sealing Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 238000012546 transfer Methods 0.000 description 12
- 230000003139 buffering effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 238000005488 sandblasting Methods 0.000 description 6
- 238000002791 soaking Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988055211U JPH0614480Y2 (ja) | 1988-04-26 | 1988-04-26 | 半導体熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988055211U JPH0614480Y2 (ja) | 1988-04-26 | 1988-04-26 | 半導体熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01162234U JPH01162234U (en]) | 1989-11-10 |
| JPH0614480Y2 true JPH0614480Y2 (ja) | 1994-04-13 |
Family
ID=31281109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988055211U Expired - Lifetime JPH0614480Y2 (ja) | 1988-04-26 | 1988-04-26 | 半導体熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0614480Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117083252A (zh) * | 2021-04-07 | 2023-11-17 | Ａｇｃ株式会社 | 二氧化硅玻璃部件及其制造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127001A (ja) * | 1999-10-28 | 2001-05-11 | Applied Materials Inc | 半導体製造装置 |
| JP2005150573A (ja) * | 2003-11-19 | 2005-06-09 | Kyocera Corp | 不純物拡散装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS605218B2 (ja) * | 1977-08-24 | 1985-02-08 | 株式会社日立製作所 | 熱バランス用治具 |
| JPS5623741A (en) * | 1979-08-06 | 1981-03-06 | Toshiba Ceramics Co Ltd | Quartz glass furnace core tube for manufacturing semiconductor |
| JPS5674923A (en) * | 1979-11-22 | 1981-06-20 | Oki Electric Ind Co Ltd | Core tube device for furnace |
| JPS5748270U (en]) * | 1980-08-30 | 1982-03-18 | ||
| JPS57162329A (en) * | 1981-03-30 | 1982-10-06 | Fujitsu Ltd | Heat treatment of semiconductor substrate |
| JPS5810354U (ja) * | 1981-07-15 | 1983-01-22 | 株式会社日立製作所 | 電界放射型陰極 |
| JPS58148427A (ja) * | 1982-10-20 | 1983-09-03 | Toshiba Ceramics Co Ltd | 半導体製造用石英ガラス製炉芯管 |
| JPS6122454A (ja) * | 1984-07-11 | 1986-01-31 | Canon Inc | 磁気光学記録媒体 |
| JPS62123713A (ja) * | 1985-11-25 | 1987-06-05 | Hitachi Hokkai Semiconductor Ltd | ウエハチヤ−ジ治具及びウエハ表面処理方法 |
| JPS62259434A (ja) * | 1986-04-14 | 1987-11-11 | Shinetsu Sekiei Kk | 石英ガラス製治具 |
| JPS6317300A (ja) * | 1986-07-08 | 1988-01-25 | Shinetsu Sekiei Kk | 石英ガラス製炉芯管 |
| JPS6331530U (en]) * | 1986-08-14 | 1988-03-01 | ||
| JPH0824109B2 (ja) * | 1986-08-29 | 1996-03-06 | 信越石英株式会社 | 石英ガラス製ウエ−ハボート搬送治具 |
-
1988
- 1988-04-26 JP JP1988055211U patent/JPH0614480Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117083252A (zh) * | 2021-04-07 | 2023-11-17 | Ａｇｃ株式会社 | 二氧化硅玻璃部件及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01162234U (en]) | 1989-11-10 |
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